Seagate Technology Off Campus Drive 2023
Company Name: Seagate Technology
Seagate Technology Off Campus Drive 2023:- The company is hiring candidates who have completed BE/B.Tech who are eligible for Engineer. For more such off-campus drives, internships, and free courses with certifications be updated on our website-http://mechomotive.com/
| Job Title | Seagate Technology Off Campus Drive 2023 |
|---|---|
| Description | • Study Ansys HFSS/SIwave/AEDT manuals and learn how to extract IC Package and PCBA models • Automate extraction and plotting of package and PCBA models • Document and Automate Seagate SI/PI flows for DDR, Serdes, PDN, and any new IP • Automate substrate design and design checking using Cadence SKILL/TCL/Python |
| Work Location | Pune – India |
| Employment Type | FULL TIME |
Seagate Technology is seeking an upcoming motivated engineer for Product Test Engineer to perform all aspects of product and test engineering including working with test functions across different geographic locations as well as with offshore OSAT (Offshore Assembling Test) locations. This role will report to Director for Hardware ATE Test Team in Seagate’s VLSI Engineering Group. The position is located in either Pune or Bengaluru, India.
Job Details for Seagate Technology Off Campus Drive 2023
- Job role:- Engineer
- Qualification:- BE/B.Tech
- Job Location:- Pune
- Salary: Best In Industry
- Experience:- 0 – 2 Years
- Apply Mode:- Online
- Vacancy:- Various
Job Description For Seagate Technology Off Campus Drive 2023
- • Study Ansys HFSS/SIwave/AEDT manuals and learn how to extract IC Package and PCBA models
- • Automate extraction and plotting of package and PCBA models
- • Document and Automate Seagate SI/PI flows for DDR, Serdes, PDN, and any new IP
- • Automate substrate design and design checking using Cadence SKILL/TCL/Python
- • Work with substrate suppliers and learn substrate design rules
- • Work with assembly subcon and learn assembly design rules
- • Learn Seagate substrate design flow and manufacturing documentation flow
- • Support VLSI Thermal Package model extraction and substrate warpage simulations as needed
- • Work with Operation, PCB, IC Designer, and SI/PI engineers
- • Present your work to the Package, PCB, IC Designer, and SI/PI engineers
Skills Required For Seagate Technology Off Campus Drive 2023
• Graduate in Electronics/E&TC engineering
• Good understanding of SI/PI and PCB or IC Package design
• Self-motivated & a strong team player
• Strong debugging and analytical skills
• Ability to work with minimum supervision
• Ability to quickly learn new tools and technologies
Your experience includes:
• Python/C programming
• Knowledge of SI/PI (Transmission Line, Impedance, Xtalk, S-parameter, PDN, EMI)
• Knowledge of storage protocols (DDR, SATA, SAS, PCIe) will be a big plus
• Familiar with PCB or IC Package design process
Apply Now:- Click Here
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